Method for manufacturing light emitting device

ABSTRACT

A method for manufacturing a light emitting device includes preparing a light transmissive member block including a first light transmissive member block having a plate like shape and including a resin containing at least one phosphor and a second light transmissive member block including a material harder than a material of the first light transmissive member block. Grooves are formed on an upper face of the second light transmissive member block. The light transmissive member block is divided at the grooves to obtain a plurality of light transmissive members each having a first light transmissive member and a second light transmissive member. A lower face of the first light transmissive member and an upper face of a light emitting element are bonded together such that a lower face perimeter of the first light transmissive member is located outside of an upper face perimeter of the light emitting element.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a divisional application of the U.S. patentapplication Ser. No. 16/536,325 filed Aug. 9, 2019, which is adivisional application of the U.S. patent application Ser. No.15/800,072 filed Nov. 1, 2017, which issued as the U.S. Pat. No.10,424,705, which claims priority to Japanese Patent Application No.2016-214618, filed on Nov. 1, 2016, No. 2017-136177, filed on Jul. 12,2017, and No. 2017-146504, filed on Jul. 28, 2017, the disclosure ofwhich is hereby incorporated by reference in its entirety.

BACKGROUND Field of the Invention

The present disclosure relates to a method for manufacturing a lightemitting device.

Discussion of the Background

Light emitting devices employing light emitting elements are widely usedas vehicular headlights and indoor and outdoor lighting fixtures. Forexample, the light emitting device disclosed in PCT Publication No.WO/2014/081042 includes a circuit board, a light emitting elementmounted on the upper surface of the circuit board, a phosphor resinlayer arranged on the upper surface of the light emitting element, adiffusion resin layer arranged on the upper surface of the phosphorresin layer for diffusing the emitted light from the light emittingelement, a first reflective material sealing the lateral faces of thelight emitting element disposed on the circuit board, and a secondreflective material surrounding the lateral faces of the diffusion resinlayer. In the light emitting device configured as above, the wavelengthof some of the light emitted from the light emitting element isconverted by the phosphor in the phosphor resin layer, and the rest ofthe light emitted from the light emitting element is externally releasedas direct radiation without undergoing wavelength conversion by thephosphor contained in the phosphor resin layer.

In the light emitting device described above, both the phosphor resinlayer and the diffusion resin layer are formed with a resin. Thephosphor resin layer, which has an area larger than that of thediffusion resin layer, is formed to have an area in excess of the upperface of the light emitting element. Furthermore, part of the secondreflective material is arranged above the upper face of the lightemitting element. The light emitting device is thus structured to beable to emit light upwards in a narrower range of area.

SUMMARY

A method for manufacturing a light emitting device according to oneembodiment of the present invention includes preparing a lighttransmissive member block having a plate like shape and including afirst light transmissive member block and a second light transmissivemember block, the first light transmissive member block having a platelike shape and including a resin containing at least one phosphor, thesecond light transmissive member block including a material harder thana material of the first light transmissive member block, an upper faceof the first light transmissive member block being bonded to a lowerface of the second light transmissive member block. Grooves are formedon an upper face of the second light transmissive member block of thelight transmissive member block. The light transmissive member block isdivided at the grooves to obtain a plurality of light transmissivemembers each having a first light transmissive member and a second lighttransmissive member. A lower face of the first light transmissive memberand an upper face of a light emitting element are bonded together suchthat a lower face perimeter of the first light transmissive member islocated outside of an upper face perimeter of the light emittingelement.

BRIEF DESCRIPTION OF THE DRAWINGS

A more complete appreciation of the invention and many of the attendantadvantages thereof will be readily obtained as the same becomes betterunderstood by reference to the following detailed description whenconsidered in connection with the accompanying drawings.

FIG. 1 is a schematic plan view of the light emitting device accordingto one embodiment.

FIG. 2 is a cross-sectional view of the light emitting device in FIG. 1taken along line

FIG. 3 is an exploded perspective view of the light emitting deviceaccording to the embodiment.

FIG. 4 is a cross-sectional view schematically showing the lightemission of the light emitting device according to the embodiment.

FIG. 5A is an explanatory diagram schematically showing the lighttransmissive member block in which a first light transmissive memberblock and a second light transmissive member block are bonded togetherin a method for manufacturing the light emitting device according to oneembodiment.

FIG. 5B is an explanatory diagram schematically showing grooves beingformed on the upper face of the second light transmissive member blockin the method for manufacturing the light emitting device according tothe embodiment.

FIG. 5C is an explanatory diagram schematically showing the grooves onthe upper face of the second light transmissive member block formed inthe method for manufacturing the light emitting device according to theembodiment.

FIG. 5D is an explanatory diagram schematically showing the first lighttransmissive member block being cut at the grooves formed in the methodfor manufacturing the light emitting device according to the embodiment.

FIG. 5E is an explanatory diagram schematically showing the lighttransmissive members after being separated into individual pieces in themethod for manufacturing the light emitting device according to theembodiment.

FIG. 5F is an explanatory diagram schematically showing the lightemitting elements and the light transmissive members bonded together inthe method for manufacturing the light emitting device according to theembodiment.

FIG. 5G is an explanatory diagram schematically showing a reflectivemember disposed in the surrounding of the light emitting elements andthe light transmissive members in the method for manufacturing the lightemitting device according to the embodiment.

FIG. 5H is an explanatory diagram schematically showing the lightemitting devices separated into individual pieces in the method formanufacturing the light emitting device according to the embodiment.

FIG. 6 is a flowchart of the method for manufacturing a light emittingdevice according to one embodiment.

FIG. 7 is a schematic plan view of a light emitting device representinga variation of the embodiment.

FIG. 8 is a schematic plan view of a light emitting device representinganother variation of the embodiment.

FIG. 9A is an explanatory diagram of a manufacturing step showing avariation of the light transmissive member in the light emitting deviceaccording to the embodiment.

FIG. 9B is a cross-sectional view of a variation of the lighttransmissive member in the light emitting device according to theembodiment.

FIG. 9C is a cross-sectional view schematically showing a variation ofthe location where the first light transmissive member and the secondlight transmissive member are defined in the light emitting deviceaccording to the embodiment.

FIG. 9D is a cross-sectional view schematically showing anothervariation of the location where the first light transmissive member andthe second light transmissive member are defined in the light emittingdevice according to the embodiment.

FIG. 10A is a schematic plan view showing the positional relationshipbetween the light transmissive members and the light emitting elementsin the light emitting devices according to the embodiment.

FIG. 10B is an enlarged cross-sectional view of the device shown in FIG.10A taken along line XB-XB.

FIG. 10C is an enlarged cross-sectional view of the device shown in FIG.10A taken along line XC-XC.

DESCRIPTION OF THE EMBODIMENTS

The embodiments will now be described with reference to the accompanyingdrawings, wherein like reference numerals designate corresponding oridentical elements throughout the various drawings.

The light emitting devices according to certain embodiments of theinvention will be explained below with reference to the accompanyingdrawings, The drawings referred to in the following explanationsschematically show the embodiments of the invention, and thus the sizes,spacing, and relative positions of the members might be exaggerated, orcertain members might be omitted. In the explanations below, moreover,those having the same designations or reference numerals indicate thesame or homogeneous as a general rule, for which the explanations mightbe omitted when appropriate. Furthermore, the directions indicated inthe drawings show relative positions of the constituent elements, andare not intended to show absolute positions thereof.

One example of the structure of the light emitting device according toan embodiment will be explained with reference to FIG. 1 to FIG. 4.

The light emitting device 100 includes at least one light emittingelement 30 each having upper face is the light extraction face, a firstlight transmissive member 1 disposed to be bonded to the upper face ofthe light emitting element 30 and formed with a phosphor-containingresin material, and a second light transmissive member 2 disposed to bebonded to the upper face of the first light transmissive member 1 andformed with a glass material. The lower face perimeter of the firstlight transmissive member 1 is positioned outside an upper faceperimeter of the light emitting element 30 in a plan view, the lowerface perimeter of the second light transmissive member 2 coincides withthe upper face perimeter of the first light transmissive member 1 or ispositioned inside the upper face perimeter of the first lighttransmissive member 1 in a plan view, while an upper face perimeter ofthe second light transmissive member 2 is positioned inside the upperface perimeter of the first light transmissive member 1 in a plan view.

In the present embodiment, the first light transmissive member 1 and thesecond light transmissive member 2 are formed as an integrated lighttransmissive member 10. The light transmissive member 10 includes thefirst light transmissive member 1 and the second light transmissivemember 2 each having an upper face and a lower face, and the upper face5 of the first light transmissive member and the lower face 8 of thesecond light transmissive member are bonded together to structure thelight transmissive member 10. The light from the light emitting element30 enters from the lower face 7 of the first light transmissive memberand is externally released from the upper face 3 of the second lighttransmissive member.

Light Emitting Element

In the present embodiment, the light emitting element 30 is flip chipmounted on the conductive wiring of the mounting base 40 via a bondingmember. The light emitting element 30 has a lower face on which a pairof electrodes are formed in the same face, and an upper face 31, inother words, the face opposite the lower face serving as the lightextraction face. For the light emitting element 30, a known lightemitting element can be utilized, and for example, a light emittingdiode or laser diode is preferably used. Moreover, an emissionwavelength can be appropriately selected for the light emitting element30. For example, for a blue or green light emitting element, oneemploying a nitride based semiconductor (In_(X)Al_(Y)Ga_(1-X-Y)N, 0≤X,0≤Y, X+Y≤1) or GaP can be used. For a red light emitting element,GaAlAs, AlInGaP, or the like can be used other than nitride basedsemiconductor elements. The light emitting element 30 can be moreover,semiconductor light emitting elements made of a material other thanthose described above, alternatively. The composition, the emissioncolor, the size, and the number of light emitting elements 30 can besuitably selected for the intended purpose. One having a set of positiveand negative electrodes on one face is preferable for the light emittingelement 30. This allows for the light emitting element 30 to be flipchip mounted on a mounting base 40. In this case, the face opposite theface on which the set of electrodes are formed serves as the primarylight extraction face of the light emitting element. In the case where alight emitting element 30 is mounted face up on the mounting base 40,the face on which a set of electrodes is formed serves as the primarylight extraction face of the light emitting element 30. The lightemitting element 30 can be electrically connected to a mounting base 40via bonding members, such as bumps.

Light Transmissive Member

The light transmissive member 10 is disposed to be bonded to the upperface 31 of the light emitting element 30 of the light emitting device100. The light transmissive member 10 includes a first lighttransmissive member 1 and a second light transmissive member 2 eachhaving an upper face and a lower face, and is structured by bonding theupper face 5 of the first light transmissive member to the lower face 8of the second light transmissive member. The first light transmissivemember 1 is a resin layer containing a phosphor, and the second lighttransmissive member 2 is a glass plate which has the role as a supportfor the first light transmissive member 1. The light transmissive member10 has a protrusion providing the upper face 3 of the second lighttransmissive member with a smaller area than that of the lower face 7 ofthe first light transmissive member. The lateral faces 6 of the firstlight transmissive member are positioned outside the lateral faces 4 ofthe second light transmissive member in a plan view.

The thickness of the light transmissive member 10 is about 60 μm to 300μm, for example. The thickness of the second light transmissive member 2is about 50% to 90% of the thickness of the light transmissive member 10mentioned above, for example.

First Light Transmissive Member

The first light transmissive member 1 is disposed to be bonded to theupper face 31 of the light emitting element 30.

The first light transmissive member 1 is formed with a resin materialwhich contains a phosphor 11. The first light transmissive member 1, forexample, is a plate-like shape, and has an upper face 5, a lower face 7opposing the upper face 5, and lateral faces 6 each in contact with theupper face 5 and the lower face 7.

The lower face 7 of the first light transmissive member is a surfacethrough which the light from at least one light emitting element 30included in the light emitting device 100 enters. The lower face 7 isformed to have a larger area than the sum of the upper faces 31 of oneor more light emitting elements 30 bonded to the lower face 7. The lowerface 7 of the first light transmissive member is formed to besubstantially flat.

In the present embodiment, the upper face 5 of the first lighttransmissive member is formed to be substantially in parallel to thelower face 7. The lateral faces 6 of the first light transmissive memberare formed substantially perpendicular to the lower face 7 of the firstlight transmissive member. Forming the lateral faces 6 substantiallyperpendicular to the lower face 7 can reduce a probability that thebonding material 15 bonding the first light transmissive member 1 andthe light emitting element 30 creeps onto the lateral faces 6 whenmanufacturing the light emitting device 100. Suppressing creepage of thebonding material 15 onto the lateral faces 6 can discourage or preventthe light emitted from the light emitting element 30 from externallyleaking without passing through the first light transmissive member 1.

Furthermore, the lower face 7 of the first light transmissive member isformed to be larger than the upper face 31 of the light emitting element30 in such a manner as to entirely cover the upper face 31 of the lightemitting element 30. In other words, the perimeter of the lower face 7of the first light transmissive member is positioned outside theperimeter of the upper face 31 of the light emitting element 30 in aplan view. The lower face 7 of the first light transmissive member isformed to have a larger area than the upper face 31 of the lightemitting element 30, thereby allowing the light emitted from the lightemitting element 30 to enter the first light transmissive member 1 witha minimum loss. The lower face 7 of the first light transmissive memberis formed to have a larger area in the range of from 105 to 150% of thesum of the upper faces 31 of one or more light emitting elements 30bonded to the lower face 7. The first light transmissive member 1 allowsthe light emitted from the light emitting element 30 to enter from thelower face 7, and then to enter the second light transmissive member 2through the lower face 8 of the second light transmissive member.

The first light transmissive member 1 is formed with a resin materialcontaining a phosphor 11 that can convert the wavelength of at leastsome of the light emitted from the light emitting element 30. Examplesof resin materials include silicone resins, epoxy resins, phenol resins,polycarbonate resins, acrylic resins, TPX resins, polynorbornene resins,or modified or hybrid resins of these. Among these examples, the firstlight transmissive member preferably includes a silicone resin due toits highly heat resistant, highly electrically insulating, andflexibility.

For the phosphor 11, a phosphor used in the art can be suitablyselected. Examples of phosphors that can be excited by a blue orultraviolet light emitting element include cerium-activated yttriumaluminum garnet-based phosphors (YAG:Ce), cerium-activated lutetiumaluminum garnet-based phosphors (LAG:Ce), europium- and/orchromium-activated nitrogen-containing calcium aluminosilicate-basedphosphors (CaO—Al₂O₃—SiO₂:Eu), europium-activated silicate-basedphosphors ((Sr,Ba)₂SiO₄:Eu), nitride-based phosphors, such as β-SiAlONphosphors, CASN-based phosphors (CaAlSiN₃:Eu), and SCASN-based phosphors((Sr,Ca)AlSiN₃:Eu), KSF-based phosphors (K₂SiF₆:Mn), sulfide-basephosphors, and quantum dot phosphors. By combining these phosphors 11and blue or ultraviolet light emitting elements, light emitting devicesof various emission colors, for example, a white light emitting device,can be manufactured. The type and the concentration of the phosphor 11contained in the first light transmissive member 1 can be adjusted tomanufacture a light emitting device 100 capable of emitting white light.The concentration of the phosphor 11 contained in the first lighttransmissive member 1 can be about 30 to 80 percent by mass, forexample.

The first light transmissive member 1 may further contain a lightdiffuser. Examples of the light diffuser include titanium oxide, bariumtitanate, aluminum oxide, silicon oxide or the like. The phosphor 11 maybe dispersed across the entire light transmissive member 1, or localizednear the upper or lower face of the first light transmissive member 1.

Moreover, by using a blue light emitting element for the light emittingelement 30, and a nitride-based semiconductor having a large redcomponent for the phosphor, a red light emitting device can be produced.By using a blue light emitting element for the light emitting element30, and a YAG phosphor in combination with a nitride-based phosphorhaving a large red component for the phosphor, an amber light emittingdevice can be produced. The color amber refers to the chromaticity rangecorresponding to the region composed of the longer wavelength region ofyellow and the shorter wavelength region of yellow-red as specified inJIS Z8110, or the region between the yellow region and the shorterwavelength region of yellow-red of the safety colors as specified in JISZ9101. For example, the amber color refers to the region over thedominant wavelength in a range of from 580 nm to 600 nm. Many phosphorsthat emit red or amber light have a low light conversion efficiency, theconcentration of the phosphor is preferably increased to achieve adesired color tone. In the case of manufacturing a red or amber lightemitting device, the concentration of the phosphor contained in thefirst light transmissive member 1 is, for example, about 60 to 80percent by mass.

Second Light Transmissive Member 2

The second light transmissive member 2 is disposed to be bonded to theupper face of the first light transmissive member 1. The second lighttransmissive member 2 is formed with a glass material. The second lighttransmissive member 2 is, for example, plate-like shape, and has anupper face 3, a lower face 8 which opposes the upper face 3, and lateralfaces 4 each contacting the upper face 3 and the lower face 8. The lowerface 8 of the second light transmissive member 2 is formed to have anarea that is the same as, or smaller than, the upper face 5 of the firstlight transmissive member 1. The lower face 8 shown in FIGS. 1-4 has asmaller area by way of example. In other words, the perimeter of thelower face 8 of the second light transmissive member 2 coincides withthe perimeter of the upper face 5 of the first light transmissive member1 or is located inside the perimeter of the upper face 5 of the firstlight transmissive member 1 in a plan view, and the perimeter of theupper face 3 of the second light transmissive member 2 is positionedinside the perimeter of the upper face 5 of the first light transmissivemember 1 in a plan view. The area of the upper face 3 of the secondlight transmissive member 2 is preferably smaller than the sum of theareas of the upper faces 31 of the one or more light emitting elements30. Moreover, the area of the upper face 3 of the second lighttransmissive member 2 is preferably 70% at most of the lower face 7 ofthe first light transmissive member 1, more preferably 50% at most. Bysetting the upper face 3 of the second light transmissive member to havea n area smaller than that of the lower face 7 of the first lighttransmissive member as described above, the light emitted from the lightemitting element 30 and then entering from the lower face 7 of the firstlight transmissive member 1 can be released from the upper face 3 of thesecond light transmissive member 2 (i.e., the emission face of the lightemitting device 100) which has a smaller area than the upper face 31 ofthe light emitting element 30. In other words, an emission face which isnarrowed by the second light transmissive member 2, the high luminancelight emitting device 100 can release light traveling a longer distance.

The lateral faces 4 of the second light transmissive member are formedsubstantially perpendicular to the upper face 3 of the second lighttransmissive member. Forming the lateral faces 4 substantiallyperpendicular to the upper face 3 of the second light transmissivemember can discourage or prevent the reflective member 20 covering thelateral faces 4 of the second light transmissive member from creepingonto the upper face 3 when manufacturing the light emitting device 100.The angle formed by the upper face 3 and each lateral face 4 of thesecond light transmissive member 2 that can discourage or prevent thecreepage of the reflective member 20 is, for example, 90 degrees plus orminus 5 degrees, and this range is referred to as substantiallyperpendicular herein. By forming the lateral faces 4 of the second lighttransmissive member 2 substantially perpendicular to the upper face 3,in the case where the upper face 3 of the second light transmissivemember serves as the emission face of the light emitting device 100, thelight emitting device 100 can exhibit an upper face in which theboundary is clearly defined between the emission part and thenon-emission part.

The thickness of the second light transmissive member 2 is preferablyequal to or larger than that of the first light transmissive member 1.For example, the thickness of the second light transmissive member 2 isabout 30 μm to 270 μm. The second light transmissive member 2 is formedwith a glass material, and examples of glass materials includeborosilicate glasses, quartz glasses, sapphire glasses, calcium fluorideglasses, alumino-borosilicate glasses, oxynitride glasses, chalcogenideglasses, and the like. The glass material used may have ananti-reflection (AR) coating on the upper face and/or the lower facethereof. The second light transmissive member 2 preferably has arefractive index close to that of the first light transmissive member 1.

As discussed above, the first light transmissive member 1 is a resinlayer containing a phosphor 11. The second light transmissive member 2is a glass material, where the second light transmissive member 2functions as the support for the first light transmissive material 1.Thus, by increasing the concentration of the phosphor 11 contained inthe first light transmissive member 1, the phosphor layer, i.e., thethickness of the first light transmissive member 1, can be formed withreduced thickness.

The first light transmissive member 1 is formed with a resin material,which is more flexible than the second light transmissive member 2 madeof a glass material, therefore it is not prone to damages even if thethickness is reduced. Even if the upper face 5 of the first lighttransmissive member is formed larger than the lower face 8 of the secondlight transmissive member, damages to the first light transmissivemember 1, such as cracking or chipping, during manufacturing or use, canbe reduced. This makes it possible to form the upper face area of thesecond light transmissive member 2 smaller than the lower face area ofthe first light transmissive member 1, thereby enabling realization ofthe light emitting device 100 higher luminance.

Furthermore, the light emitting device 100 has a narrowed emission facewhich is the second light transmissive member 2 made of a glassmaterial, therefore, the emission face of the light emitting device 100is not susceptible to degradation attributable to long term use.

Bonding Material

The light emitting element 30 and the light transmissive member 10 canbe bonded together using a bonding material 15. The bonding material 15is disposed continuously from the upper face of the light emittingelement 30 to at least part of each lateral face while being interposedbetween the reflective member 20 and the lateral faces of the lightemitting element 30. The upper face of the bonding material 15interposed between the reflective member 20 and the lateral faces of thelight emitting element 30 is in contact with the lower face 7 of thefirst light transmissive member. For the bonding material 15, it ispreferable to use a light transmissive material that can guide the lightemitted from the light emitting element 30 into the first lighttransmissive member 1. Examples of the bonding material 15 can be aknown bonding material, such as epoxy resins or silicone resins, anorganic bonding material having a high refractive index, an inorganicbonding material, a low melting point glass, or the like. The bondingmaterial 15 is preferably disposed to extend from the upper face 31 ofthe light emitting element 30 to the lateral faces while forming fillets16. Preferably, the fillets 16 are in contact with both the lower face 7of the first light transmissive member and the lateral faces of thelight emitting element 30, and each have a curved face that is concavewith respect to the reflective member 20. Such a shape allows the filletsurfaces of the bonding member 15 to readily reflect the light emittedfrom the light emitting element 30, and guide the light into the firstlight transmissive member 1.

The light transmissive member 10 and the light emitting element 30 maybe bonded together by crimping or the like instead of using a bondingmaterial 15.

The reflective member 20, as shown in FIG. 1, FIG. 2, and FIG. 4,reflects the light traveling in the directions other than towards theupper face 3 of the second light transmissive member such that it isreleased from the upper face 3 of the second light transmissive member,as well as covering the lateral faces of the light emitting element 30to protect the light emitting element 30 from external forces, dust,gas, or the like. The reflective member 20 is disposed to cover thefirst light transmissive member, light emitting element 30, and part ofthe upper face of the mounting base 40 while exposing the upper face 3of the light transmissive member 10 (i.e., the upper face 3 of thesecond light transmissive member) to serve as the emission face of thelight emitting device 100. Specifically, the reflective member 20 isdisposed to cover the lateral faces 4 of the second light transmissivemember, the upper face 5 and the lateral faces 6 of the first lighttransmissive member, the lateral faces of the bonding material 15, andthe lateral faces and the lower face of the light emitting element 30.The light extraction face of the light emitting element 30 is exposedfrom the reflective member 20, and is bonded to the lower face 7 of thefirst light transmissive member to allow the light to enter the lighttransmissive member 10. The reflective member 20 is formed with amaterial that can reflect the light from the light emitting member 30,and reflects the light at the interfaces between the light transmissivemember 10 and the reflective member 20 to allow the light to enter thelight transmissive member 10. In this manner, the light emitted from thelight emitting element 30 is reflected by the reflective member 20 topass through the light transmissive member 10 to be externally releasedfrom the upper face 3 of the second light transmissive member which isthe emission face of the light emitting device 100.

Here, the upper face of the reflective member 20 preferably has a heightthat is the same as, or lower than, that of the upper face 3 of thesecond light transmissive member. The light released from the upper face3 of the second light transmissive member serving as the emission faceof the light emitting device 100 also laterally spreads. For thisreason, if the upper face of the reflective member 20 is higher than theupper face 3 of the second light transmissive member, the light emittedfrom the upper face 3 of the second light transmissive member can hitand be reflected by the upper face of the reflective member 20, causingvariance in luminous intensity to occur. Accordingly, the reflectivemember 20 is disposed to cover the exterior lateral faces of the secondlight transmissive member such that the height of the upper face of thereflective member 20 is substantially the same as, or lower than, theupper face 3 of the second light transmissive member. This is preferablebecause the light emitted from the light emitting element 30 can beefficiently extracted.

The reflective member 20 can be formed by adding a light reflectingsubstance to the base material made of a silicone resin, modifiedsilicone resin, epoxy resin, modified epoxy resin, acrylic resin, or ahybrid resin containing at least one of these resins, Examples of thelight reflecting substance include titanium oxide, silicon oxide,zirconium oxide, yttrium oxide, yttria-stabilized zirconia, potassiumtitanate, alumina, aluminum nitride, boron nitride, mullite. Thereflective member 20 can reflect or transmit in varying amount of lightdepending on the concentration or the density of the light reflectingsubstance contained therein. Thus, the concentration and the density canbe suitably adjusted in accordance with the shape and size of the lightemitting device 100. Furthermore, forming the reflective member 20 witha material that has heat dissipation properties in addition to lightreflecting properties can increase heat dissipation at the same time.Examples of such materials include aluminum nitride and boron nitridewhich have high thermal conductivity.

Mounting Base

The mounting base 40 mounts at least one light emitting element 30, andelectrically connects the light emitting device 100 with an externalpower supply. The mounting base 40 is configured with a plate-likesupport member and conductive wiring patterns disposed on the surface ofand/or in the support member. The structure of the mounting base 40,including the shapes and sizes of the electrodes, is set in accordancewith the structures and sizes of the electrodes of the light emittingelement 30. On the lower face of the mounting base 40, a heatdissipation terminal which is electrically independent from the lightemitting element 30 can be provided. It is preferable to form the heatdissipation terminal to have an area larger than the sum of the upperface areas of all light emitting elements 30 included in the lightemitting device 100, and is disposed to overlap the areas directly underthe light emitting elements 30. Such a structure of the heat dissipationterminal can provide the light emitting device 100 with good heatdissipation.

For the support member of the mounting base 40, it is preferable to usean insulating material that does not readily transmit the emitted lightfrom the light emitting element 30 or external light. The mounting base40 is preferably formed with a material having a certain degree ofstrength. Specific examples of such materials include ceramics such asalumina, aluminum nitride, and mullite, and resins such as phenolresins, epoxy resins, polyimide resins, bismaleimide triazine BT resins,and polyphthalamide (PPA). The support member may have a structure thatincludes a cavity. This simplifies the formation of the reflectivemember 20 by allowing the material of the reflective member 20 to bedripped and cured.

The conductive wiring and the heat dissipation terminal can be formed byusing, for example, metals such as Cu, Ag, Au, Al, Pt, Ti, W, Pd, Fe,and Ni, or an alloy containing these elements. Such conductive wiringcan be formed by electroplating, electroless plating, vapor deposition,sputtering, or the like.

The light emitting device 100 has the structure explained above, whichallows the light emitted from the light emitting element30 to travel along distance when used for a headlight for motorcycles, automobiles,ships, airplanes, or the like, for example. In other words, as shown inFIG. 4, when light is emitted from one or more light emitting elements30 in the light emitting device 100, some of the light propagatesthrough the light transmissive member 10 without being reflected by thereflective member 20 directly towards the upper face 3 of the secondlight transmissive member 2, and some other light exits from the upperface 3 of the second light transmissive member 2 after being reflectedby the reflective member 20. In the light emitting device 100, moreover,by setting the lower face 7 of the first light transmissive member tohave a larger area than the sum of the upper face areas of the lightemitting elements 30, the emitted light from the light emitting elements30 can be received with a minimum loss. At the same time, the upper face3 of the second light transmissive member has a smaller area than thesum of the upper face areas of the light emitting elements 30. The upperface 3 of the second light transmissive member also has a smaller areathan the lower face 7 of the first light transmissive member.Accordingly, the light emitted from the light emitting elements 30 isconcentrated by the light transmissive member 10 onto the upper face 3of the second light transmissive member. This can realize a highluminance light emitting device 100 suited for high beam headlightswhose emission light can reach a region over a long distance. In FIG. 4,representative traveling directions of light are schematically shownusing arrows.

Method for Manufacturing Light Emitting Device

The manufacturing method S10 for the light emitting device 100 shown bythe flowchart in FIG. 6 will be explained primarily with reference toFIGS. 5A-5H.

Light Transmissive Member Block Preparation Step S11

As shown in FIG. 5A, a plate-like light transmissive member block A10 isprovided by bonding the upper face of a first light transmissive memberblock Al to the lower face of a second light transmissive member blockA2. The first light transmissive member block A1 has a plate-like shapeformed with resin material containing at least one phosphor. The secondlight transmissive member block A2 is formed with a material harder thanthe first light transmissive member block A1. The first lighttransmissive member block A1 is a phosphor-containing resin layer, whichcontains a phosphor 11 capable of wavelength conversion of some of thelight from the light emitting element 30. The second light transmissivemember block A2 is glass which is formed or processed into a plate like.For example, the light transmissive member block A10 can be formed byprinting a phosphor-containing resin layer on the lower face of a glassplate. The first light transmissive member block A1 may be bonded to thelower surface of the second light transmissive member block A2 viaanother member such as a bonding material, instead of being directlybonded thereto. Examples of the joining method include crimping, fusing,sintering, adhesion using an organic bonding material, and adhesionusing an inorganic bonding material such as low melting point glass. Thefirst light transmissive member block Al can be formed by using aprinting, compression molding, phosphor electrodeposition, joining withphosphor sheet, or other technique. In the case of a printing method, aphosphor layer is formed by preparing a paste containing a phosphor,binder, and solvent, coating the lower face of the second lighttransmissive member block 2A with the past, and drying.

The first light transmissive member block Al and the second lighttransmissive member block A2 undergo the steps described below to beformed into light transmissive members 10 each equipped with a firstlight transmissive member 1 and a second light transmissive member 2.The lower face of the first transmissive member block A1 forms the lowerfaces of the light transmissive members 10, and upper face of the secondlight transmissive member block A2 forms the upper faces of the lighttransmissive members 10.

Groove Forming Step S12

Subsequently, as shown in FIGS. 5B and 5C, grooves Dt are formed on theupper face of the second light transmissive member A2 in the lighttransmissive member block A10 by using a blade Br1 of a machine tool.The grooves Dt may go through the second light transmissive member blockA2 to reach the first transmissive member block Al, but is not requiredto reach it. In the present embodiment, the grooves Dt are formed toreach the first light transmissive member block A1, such that the firstlight transmissive member block A1 is exposed at the bottom of eachgroove Dt. Furthermore, the grooves Dt formed in this step form thelateral faces 4 of the second light transmissive members in the lighttransmissive members 10. In the step of forming the grooves Dt, thesecond light transmissive member block A2 is machined such that eachupper surface of the second light transmissive members is formed to havea rectangular shape smaller than the upper face 31 of the light emittingelement 30. The second light transmissive member 2 is formed with aharder material than the first light transmissive member 1, whichfacilitates machining using the blade Br1, for example, it won't bedestructed as in the case of a highly viscous material such as a resin,resulting in sharp corners for the rectangles. The grooves Dt may beformed by other known methods, such as laser machining.

It is preferable to use a material having a hardness on the Mohs scaleof, for example, from 3 to 10 for the second light transmissive memberblock A2. The hardness in this range can reduce the likelihood ofdestructing corners during machining.

Light Transmissive Member Forming Step S13

As shown in FIGS. 5D and 5E, the light transmissive member block A10 isdivided at the grooves Dt into individual light transmissive members 10each having a first light transmissive member 1 and a second lighttransmissive member 2. When divided, a plurality of light transmissivemembers 10 where the lower face 7 of each first light transmissivemember 1 has a larger area than the upper face of the light emittingelement 30 are obtained. In this step, the first light transmissivemember block A1 is cut at the grooves Dt into individual lighttransmissive members 10 by using a blade Br2 having a narrower widththan that used in creating the grooves Dt. The area inside the perimeterof the lower face 7 of a first light transmissive member when dividedinto a light transmissive member 10 is larger than the sum of the areasof the upper faces 31 of one or more light emitting elements 30installed in a light emitting device 100. Each light transmissive member10 thus obtained has a protrusion, and the upper face 3 of the secondlight transmissive member is smaller than the lower face 7 of the firstlight transmissive member. The cut surfaces of the first lighttransmissive member block A1 form the lateral faces 6 of the first lighttransmissive member, and the grooves Dt form the lateral faces 4 of thesecond light transmissive member in a light transmissive member 10. Thelateral faces 6 of the first light transmissive member are locatedoutside the lateral faces 4 of the second light transmissive member in aplan view.

The first transmissive member block A1 is formed with a resin material,therefore, it is more flexible and less susceptible to damages comparedto one formed with a glass material. In other words, it won't be readilycracked or chipped when being divided into individual pieces, the firstlight transmissive member can be formed with a reduced thickness.

For the first light transmissive member block A1, it is preferable touse a material having a Shore hardness of, for example, from A30 to D50after cured. The hardness in this range allows for the light emittingdevice 100 to maintain the strength during use, as well as reducingdamages such as cracking and chipping during manufacturing or use.

Furthermore, in the case where the phosphor 11 is localized on the lowerface side of the first light transmissive members 1 in the first lighttransmissive member block A1, in other words, the faces opposite thefaces bonded to the second light transmissive member block A2, the areaon the upper face side where the phosphor is not substantially presentcan be exposed at the bottoms of the grooves Dt when the grooves Dtreach the first light transmissive member block A1 in the groove formingstep S12 discussed above. In other words, even if the grooves Dt reachthe first light transmissive member block A1 in forming the grooves, theamount of the phosphor contained in the first light transmissive memberblock A1 would not change. This can attenuate color shift or colornon-uniformity attributable to a decline of the phosphor content.

Mounting Base and Light Emitting Element Preparation Step

A light emitting element 30 and a mounting base 40 are separatelyprovided. The light emitting element 30 and the mounting base 40 can beprovided any time before the step of bonding the light transmissivemember 10.

The mounting base 40 is formed to a rectangular plate shape in a planview, and is provided with, for example, a conductive wiring pattern anda heat dissipation terminal on the support member. In the presentembodiment, the mounting base 40 may include a cathode mark at onecorner of the upper face of the mounting base using the same material asthat for the electrodes, which are the conductive wiring.

At least one light emitting element 30 is mounted on the mounting base40. Here, a single light emitting element 30 per light emitting device100 is mounted on the conductive wiring of the mounting base 40 viabonding members such as bumps or the like.

Light Transmissive Member Bonding Step S14

As shown in FIG. 5F, the lower face of the light transmissive member 10and the upper face 31 of the light emitting element 30 are bondedtogether such that the lower face perimeter of the first lighttransmissive member 1 in the light transmissive member 10 is positionedoutside the perimeter of the upper face 31 of the light emitting element30.

In the present embodiment, the light emitting element 30 and the firstlight transmissive member 1 are bonded using a bonding material 15. Inbonding using a bonding material 15, the bonding material 15 is drippedon the upper face 31 of the light emitting element 30, followed byplacing the light transmissive member 10 on the bonding material 15. Thedripped bonding material 15 is pressed down by the light transmissivemember 10, wetting and spreading onto the lateral faces of the lightemitting element 30 to form fillets 16 between the lateral faces of thelight emitting element 30 and the lower face of the light transmissivemember 10. The amount and the viscosity of the bonding material 15 to bedripped can be suitably adjusted in such a manner as to form the fillets16 on the lateral faces of the light emitting element 30, but not wetand spread to the mounting base 40.

The lower face 7 of the first light transmissive member in the lighttransmissive member 10 is bonded to the light emitting element 30 viathe bonding material 15 disposed on the upper face of the light emittingelement 30. It is preferable to form the light transmissive member 10such that the area of the lower face 7 of the first light transmissivemember is larger than the sum of the areas of the upper faces 31 of oneor more light emitting elements 30, and the light transmissive member isplaced such that the distances from the lateral faces of the lightemitting element 30 to the perimeter of the lower face 7 of the firstlight transmissive member are substantially equal. The lighttransmissive member 10 is preferably arranged such that the center ofthe upper face 3 of the second light transmissive member substantiallyoverlaps the center of one or more light emitting elements 30 as a wholewhich are orderly arranged to form an overall rectangular shape in aplan view. The light transmissive member 10 bonded to the light emittingelements 30 includes a first light transmissive member whose lower face7 is larger than the sum of the upper faces 31 of the light emittingelements 30. Accordingly, the light transmissive member 10 has astructure allowing the light emitted from the upper faces 31 of thelight emitting elements 30 to take into the lower face 7 of the firstlight transmissive member which has a larger area than the upper faces31, and guiding the light towards the upper face 3 of the second lighttransmissive member which has a smaller area than the upper faces 31 ofthe light emitting elements 30.

Reflective Member Supplying Step S15

Subsequently, as shown in FIG. 5G, a reflective member 20 which coversthe light emitting element 30, the light transmissive member 10, and themounting base 40 is disposed. The light emitting device 100 may have areflective member 20 composed of one or more types of materials. Whatfollows is an example in which a two-layer reflective member 20 isformed.

First Reflective Member Supplying Step

A reflective member 20 is supplied between the light emitting element 30and the mounting base 40, and up to the height that covers the lightemitting element 30 and the bonding material 15 on the lateral faces ofthe light emitting element 30. It is preferable to use a material havinga low linear expansion coefficient for the reflective member 20 ifdisposed between the light emitting element 30 and the mounting base 40.This can attenuate the heat stress at the bonded locations between thelight emitting element 30 and the mounting base 40.

Second Reflective Member Supplying Step

Subsequently, a reflective member 20 that is to cover the lateral facesof the light transmissive member 10 is supplied. The reflective member20 covers the lateral faces 4 of the second light transmissive member,the upper face 5 and the lateral faces 6 of the first light transmissivemember. At this point, it is preferable to drip the reflective member 20on the upper face of the mounting base 40 distant from the lighttransmissive member 10 such that the upper face 3 of the second lighttransmissive member is exposed from the reflective member 20. Thereflective member 20 is supplied to cover the surface of the reflectivemember 20 supplied earlier.

For the reflective member 20 here, a silicone resin containing titaniumoxide is used by way of example.

Dividing Step S16

As shown in FIG. 5H, after forming the reflective member 20, themounting base 40 is cut into individual light emitting device units bylaser irradiation or using tools such as blades to form the lightemitting devices 100. The light emitting device 100 manufactured by thesteps described above allows the light emitted from one or more lightemitting elements 30 to enter from the lower face 7 of the first lighttransmissive member which has a larger area than the sum of the areas ofthe upper faces 31 of the light emitting elements 30, and be externallyreleased as high intensity light from the upper face 3 of the secondlight transmissive member which has a smaller area than the lower face 7of the first light transmissive member. Moreover, the first lighttransmissive member 1 formed with a resin material is less susceptibleto damages due to cracking during the manufacturing process even if thedifference in the areas between the first light transmissive member 1and the second light transmissive member 2 is increased, therebyincreasing the production yield. The second light transmissive memberformed with a glass material makes the emission face of the lightemitting device 100 less susceptible to degradation, thereby achievinghigh product quality.

Variations

The light emitting device 100 may be configured with a plurality oflight emitting elements 30, and the light transmissive member 10 may beshaped in various ways. For example, as shown in FIG. 7, FIG. 8, andFIGS. 9A-9D, a light emitting element group 30A or 30B which isconfigured with a plurality of light emitting elements may be providedas in the case of a light emitting device 100A or 100B, and a lighttransmissive member may have oblique lateral parts as in the case oflight transmissive member 10A, 10B, or 10C. Each of these componentswill be explained below. The components and the manufacturing methodsalready explained as the light emitting device 100 will refer to thesame reference numerals, hence the explanations therefor will be omittedwhen appropriate.

In the light emitting device 100A, a plurality of light emittingelements 30 may be arranged as a light emitting element group 30A. Asshown in FIG. 7, for example, two same size light emitting elements 30are arranged adjacent to one another in a light emitting element group30A. When the light emitting elements 30 are adjacent to one another,the lower face 7 of the first light transmissive member of the lighttransmissive member 10 is formed to be larger than the total area of thetwo light emitting elements 30 arranged side by side. The area of thelight emitting element group 30A is the rectangular area enclosing theouter perimeters of the two light emitting elements 30 with straightlines in which the area between the light emitting elements isconfigured as part of the upper face area of the light emitting elementgroup 30A. The light transmissive member 10 includes a second lighttransmissive member whose upper face 3 has a smaller area than the areaof the light emitting element group 30A. The light emitting device 100Aconfigured as above allows the light from the plurality of lightemitting elements 30 to enter from the lower face 7 of the first lighttransmissive member, and be externally released from the upper face 3 ofthe second light transmissive member which has smaller area than thelower face 7 of the first light transmissive member. Thus, the lightemitting device can release higher intensity light that travels a longerdistance.

Another example shown in FIG. 8 has six light emitting elements 30orderly arranged as a light emitting element group 30B. The lighttransmissive member 10 is formed such that the lower face 7 of the firstlight transmissive member has larger area than that of the lightemitting element group 30B, which is the total area of the array of thesix light emitting elements 30. The area of the light emitting elementgroup 30B is the rectangular area enclosing the outer perimeters of thesix light emitting elements 30 using straight lines in which the areasbetween the light emitting elements is configured as part of the upperface area of the light emitting element group 30B. Furthermore, thelight transmissive member 10 is formed such that the upper face 3 of thesecond light transmissive member has smaller area than that of the lightemitting element group 30B. The light emitting device 100B configured asabove can also allow the light from the plurality of light emittingelements 30 to enter from the lower face 7 of the first lighttransmissive member, and be externally released from the upper face 3 ofthe second light transmissive member which has smaller area than that ofthe lower face 7 of the first light transmissive member. Thus, the lightemitting device can release higher intensity light that travels a longerdistance.

As shown in FIG. 9B, the lateral faces 4A of the second lighttransmissive member may each include a perpendicular part 4 a and anoblique part 4 b. The lateral faces 4A of the second light transmissivemember each have a perpendicular part 4 a which continues from andsubstantially perpendicularly to a direction of the upper face 3 of thesecond light transmissive member. The lateral faces 4A of the secondlight transmissive member also each have an oblique part 4 b whichcontinues from the perpendicular part 4 a and across the upper face 5 ofthe first light transmissive member. The oblique part 4 b is formed toflare from the upper face side to the lower face side. The oblique part4 b, moreover, is a curved surface that is inwardly convex and continuesfrom the perpendicular part 4 a and across the upper face 5 of the firstlight transmissive member. By having the oblique parts 4 b, the secondlight transmissive member can efficiently guide the light from the lightemitting elements 30 towards the upper face 3 of the second lighttransmissive member with a reduced number of reflection, therebyproviding a highly luminous light emitting device. The oblique parts 4b, moreover, allow the lower face 8 of the second light transmissivemember and the upper face 5 of the first light transmissive member tohave the same shape. This allows the second light transmissive member tosupport the first light transmissive member 1 made of a resin across abroader area, thereby increasing the structural strength of the lighttransmissive member 10A.

The light emitting device 100 includes at least one light emittingelement 30, and the number of light emitting elements can be two or sixas described earlier, or three, four, five or seven or even more.

As shown in FIG. 9A, the oblique parts 4 b can be formed by using ablade Br3 which is used for forming the grooves Dt shown in FIG. 5C. Theblade Br3 has a narrower width than the blade Br2 shown in FIG. 5D, andis operated while changing the penetration depth to provide a groove Dtwith a perpendicular part 4 a and an oblique part 4 b. The lateral faces4A having a perpendicular part 4 a and an oblique part 4 b are formed inthis manner. Alternatively, the grooves Dt having an oblique part may beformed by using a blade for making bevels. The oblique part 4 b is shownas a curved line in the cross section, but can be formed as a straightline.

Furthermore, changing the shape, the penetration depth, or the like ofthe blade Br3 for forming the grooves Dt can create a light transmissivemember 10B or 10C in which the first light transmissive member and thesecond light transmissive member have differently shaped lateral faces.

As shown in FIG. 9C, the lateral faces 9B of the light transmissivemember 10B each have an oblique part 4 bb. The light transmissive member10B, similar to the light transmissive member 10A, has the first lighttransmissive member 1B and the second light transmissive member 2B thatare integrally formed. The first light transmissive member 1B and thesecond light transmissive member 2B each have an upper face and a lowerface, and the upper face 5 b of the first light transmissive member andthe lower face 8 b of the second light transmissive member are bondedtogether to configure the light transmissive member 10B. Similar to thelight transmissive member 10 or the like described earlier, the lighttransmissive member 10B allows the light from the light emitting element30 to enter from the lower face 7 of the first light transmissivemember, and be externally released from the upper face 3 of the secondlight transmissive member.

Similar to the light transmissive member 10 discussed earlier, the lighttransmissive member 10B has a lower face 7, an upper face 3 having asmaller area than the lower face 7, and lateral faces 9B.

Each of the lateral faces 9B of the light transmissive member 10B has afirst perpendicular parts 6B, an oblique part 4 bb, and a secondperpendicular part 4 ba, in that order from the lower face side. Thefirst perpendicular parts 6B is a part which continues from andsubstantially perpendicular to the lower face 7, consisting of a lateralface 6 b of the first light transmissive member 1B and a perpendicularpart 4 bc which is part of the lateral face of the second lighttransmissive member 2B. The second perpendicular part 4 ba is a partthat continues from and substantially perpendicular to the upper face 3.The oblique part 4 bb is positioned between the first perpendicularparts 6B and the second perpendicular part 4 ba, and is oblique in sucha manner as to flare from the upper face side to the lower face side.The oblique part 4 bb is a curved face that protrudes inward.

The interface between the first light transmissive member 1B and thesecond light transmissive member 2B, which is the bonding face betweenthe first light transmissive member 1B and the second light transmissivemember 2B, of the light transmissive member 10B is substantially inparallel to the lower face 7 and in contact with the first perpendicularparts 6B.

In the light transmissive member 10B, the lateral faces of the secondlight transmissive member 2B each have a perpendicular lateral face 4ba, which is the second perpendicular lateral face of the lighttransmissive member 10B, that continues from the upper face 3 of thesecond light transmissive member 2B, an oblique part 4 bb, which is thelateral face of the light transmissive member 10B, that continues fromthe perpendicular lateral face 4 ba while flaring from the upper faceside to the lower face side, and a perpendicular lateral face 4 bc,which is part of the perpendicularlateral face 6B of the lighttransmissive member 10B, that continues from the oblique part 4 bb, andconnects and is substantially perpendicular to the lower face of thesecond light transmissive member.

Furthermore, the lateral faces 6 b of the first light transmissivemember 1B continue from the second light transmissive member 2B. Thelateral faces 6 b of the first light transmissive member 1B serves asone of the first perpendicular parts 6B of the light transmissive member10B such that the first perpendicular parts 6B is configured togetherwith the perpendicular part 4 bc of the second light transmissive member2B. In other words, the upper face perimeter of the first lighttransmissive member 1B in the light transmissive member 10Bsubstantially coincides with the lower face perimeter of the secondlight transmissive member 2B in a plan view.

Such a shape allows for a further reduction of the thickness of thefirst light transmissive member 1B formed with a resin materialcontaining a phosphor 11. Moreover, for securely supporting thephosphor-containing resin layer with reduced thickness, and ease ofmachining, the thinnest part of the second light transmissive member 2Bhas preferably substantially the same as or larger thickness than thatof the thinnest part of the first light transmissive member 1B.

The lateral faces 9C of the light transmissive member 10C, as shown inFIG. 9D, each have an oblique parts 4C. Similar to the lighttransmissive member 10A, a first light transmissive member 1C and asecond transmissive member 2C integrally form the light transmissivemember 10C. The first light transmissive member 1C and the second lighttransmissive member 2C each have an upper face and a lower face, and theupper face 5 c of the first light transmissive member and the lower face8 c of the second light transmissive member are bonded together toconfigure the light transmissive member 10C. The light transmissivemember 10C also allows the light from the light emitting element 30 toenter from the lower face 7 of the first light transmissive member andbe externally released from the upper face 3 of the second lighttransmissive member in a similar manner to that in the case of the lighttransmissive member 10 or the like described earlier.

The light transmissive member 10C, similar to the light transmissivemember 10 discussed earlier, has a lower face 7, an upper face 3 havinga smaller area than the lower face 7, and lateral faces 9C.

As a lateral face 9C, the light transmissive member 10C has a firstperpendicular lateral part 6 c, an oblique parts 4C, and a secondperpendicular lateral part 4 ca in that order from the lower face side.The first perpendicular lateral part 6 c is a part that continues fromand is substantially perpendicular to the lower face 7, and the secondperpendicular lateral part 4 ca is a part that continues and issubstantially perpendicular to the upper face 3. The oblique parts 4C ispositioned between the first perpendicular lateral part 6 c and thesecond perpendicular lateral face 4 ca, and is oblique in such a manneras to spread out from the upper face side to the lower face side. Theoblique parts 4C is a curved face that protrudes inward. The obliqueparts 4C is formed across the first light transmissive member 1C and thesecond light transmissive member 2C, consisting of an oblique lateralpart 6 cb and an oblique lateral part 4 cb.

The interface between the first light transmissive member 1C and thesecond light transmissive member 2C in the light transmissive member 10Cis substantially in parallel to the lower face 7 and in contact with theoblique parts 4C.

The lateral faces of the second light transmissive member 2C in thelight transmissive member 10C each have a perpendicular lateral part 4ca that continues from the upper face 3 of the second light transmissivemember 2C. The perpendicular lateral part 4 ca of the second lighttransmissive member 2C can be referred to as the second perpendicularlateral part of the light transmissive member 10C. Each of theperpendicular lateral part 4 ca continues to an oblique lateral part 4cb which spread out from the upper face side to the lower face side. Theoblique lateral part 4 cb can be referred to as the oblique lateral partof the light transmissive member 10C. The oblique lateral parts 4 cbconnect to the lower face 8 c of the second light transmissive member,and continue to the oblique lateral parts 6 cb of the first lighttransmissive member 1C. The lateral faces of the first lighttransmissive member 1C each have an oblique lateral part 6 cb and thefirst perpendicular lateral part 6 c. The perpendicular lateral part 6cb continues from the second light transmissive member 2C whilespreading out from the upper face side to the lower face side. Theperpendicular lateral part 6 cb can be referred to as part of theoblique lateral part 4C of the light transmissive member 10C. The firstperpendicular lateral part 6 c continues from the oblique lateral part 6cb while connecting and being substantially perpendicular to the lowerface 7 of the first light transmissive member 1C.

In other words, in the light transmissive member 10C, the upper faceperimeter of the first light transmissive member 1C substantiallycoincides with the lower face perimeter of the second light transmissivemember 2C in a plan view.

Such a shape can increase the percentage of the thickness of the firstlight transmissive member 1C in the light transmissive member 10C, andit is therefore effective in the case, for example, of requiring alarger amount of the phosphor 11 to achieve a given emission color.

In the first light transmissive member 1B and the second lighttransmissive member 2B of the light transmissive member 10B, and thefirst light transmissive member 1C and the second light transmissivemember 2C of the light transmissive member 10C, their thicknesses cansuitably be adjusted to form the lateral faces 9B and the lateral faces9C, respectively, as compared to the light transmissive member 10.

Furthermore, in the light transmissive member 10B, the oblique parts 4bb and the first perpendicular lateral parts 6B may be continuous, orhave a plane between them which is substantially in parallel to theupper face 3. In the case where the oblique parts 4 bb each have atangent that is substantially perpendicular to the upper face 3 in thevicinity of the upper face of the light transmissive member 10B, theconstruction may be such that the oblique parts 4 bb include theseregions as the second perpendicular parts 4 ba.

Similarly, in the light transmissive member 10C, the oblique parts 4Cand the first perpendicular lateral part 6 c may be continuous, or havea plane between them which is substantially in parallel to the upperface 3. In the case where the oblique parts 4C have tangents that aresubstantially perpendicular to the upper face 3 in the vicinity of theupper face of the light transmissive member 10C, the structure may besuch that the oblique parts 4C include these regions as the secondperpendicular lateral parts 4 ca.

Furthermore, the light transmissive member 10, 10A, 10B, or 10C may havea similar structure to that of the light transmissive member 10D shownin FIGS. 10A-10C. Two of the four lateral faces of the lighttransmissive member 10D are perpendicular lateral parts 9D1 whichcontinues to the upper face and the lower face. In other words, in thelight transmissive member 10D, the upper face perimeter of the secondlight transmissive member 2D partly coincides with the lower faceperimeter of the first light transmissive member 1D while the rest ofpart is positioned inside the lower face perimeter of the first lighttransmissive member 1D, in a plan view.

Making the lower face area of the first light transmissive member 1Dlarger, and the upper face area of the second light transmissive member2D smaller, than the sum of the upper face areas of the light emittingelements 30 enables such a light emitting device 100D to also achievehigher luminance. In the light emitting device 100D, the lighttransmissive member 10D includes lateral faces 9D each having an obliqueparts 9D along the long side, and perpendicular lateral parts 9D1 alongthe short side, of the orderly arranged light emitting elements 30. Inother words, the perpendicular lateral parts 9D1, as part of the upperface perimeter of the second light transmissive member 2D, are the partsthat coincide with the lower face perimeter of the first lighttransmissive member 1D, in a plan view. Together with those disposedalong the short sides, the long sides of the first light transmissivemember 1D may be configured with a perpendicular lateral parts 9D1. Theperpendicular lateral parts 9D1 may constitute any one side, or aplurality of perpendicular lateral parts 9D1 may constitute two adjacentsides, or three continuous sides of the rectangular shape in a planview.

In the light emitting devices 100, 100A, and 100B described above, itwas explained that the lower faces of the second light transmissivemembers have different sizes from the upper faces of the first lighttransmissive members. However, similar to that shown in FIG. 9C, thelight transmissive member may be configured such that the lower face 8of the second light transmissive member and the upper face 5 of thefirst light transmissive member have the same size, and the upper face 3of the second light transmissive member is positioned inside the upperface 5 of the first light transmissive member. This structure allows forthe light to be more readily guided from the upper face 5 of the firstlight transmissive member to the lower face 8 b of the second lighttransmissive member, thereby increasing the light extraction efficiencyof the light emitting devices 100, 100A, and 100B. This is preferablefor a structure of a plurality of light emitting elements 30 bonded to asingle light transmissive member 10 as it reduces the effect of thearrangement of the light emitting element 30, on the luminous intensitydistribution, luminance non-uniformity, and color non-uniformity.Furthermore, a phosphor, diffuser, or the like may be included in thebonding material 15 that bonds the light transmissive member 10 and thelight emitting elements 30 together. Moreover, in the case of mounting aplurality of light emitting elements 30, the light transmissive member10 may be individually bonded to the light emitting elements 30.

In the light emitting devices 100 and 100A-100D according to theembodiment, a protection device, such as a Zener diode, may be mountedon the mounting base 40. Embedding such a protection device in thereflective member 20 can discourage or prevent light extractionefficiency from declining attributable to absorption or blocking of thelight from the light emitting element 30 by the protective device.

When two light emitting elements 30 are used, it is preferable to setthe space between the two light emitting elements 30 such that thefillets 16 made of the bonding material 15 are formed continuously.Specifically, in the case where any of the light emitting device 100 and100A-100D includes two or more light emitting elements 30, the distancebetween two adjacent light emitting element 30 is preferably twice theheight of a light emitting element 30 at most.

The light emitting device according to the embodiment can be used as alight source for the headlights of vehicles such as motorcycles andautomobiles, or transportation equipment such as ships and aircrafts. Inaddition, the light emitting device is also applicable as a variety oflight sources for various lighting fixtures such as spotlights, displaydevices, automotive parts, and the like.

Obviously, numerous modifications and variations of the presentinvention are possible in light of the above teachings. It is thereforeto be understood that within the scope of the appended claims, theinvention may be practiced otherwise than as specifically describedherein.

What is claimed is:
 1. A method for manufacturing a light emittingdevice, the method comprising: preparing a light transmissive memberblock having a plate like shape and comprising a first lighttransmissive member block and a second light transmissive member block,the first light transmissive member block having a plate like shape andcomprising a resin containing at least one phosphor, the second lighttransmissive member block comprising a material harder than a materialof the first light transmissive member block, an upper face of the firstlight transmissive member block being bonded to a lower face of thesecond light transmissive member block; forming grooves on an upper faceof the second light transmissive member block of the light transmissivemember block; dividing the light transmissive member block at thegrooves to obtain a plurality of light transmissive members each havinga first light transmissive member and a second light transmissivemember; and bonding a lower face of the first light transmissive memberand an upper face of a light emitting element together such that a lowerface perimeter of the first light transmissive member is located outsideof an upper face perimeter of the light emitting element.
 2. The methodaccording to claim 1, wherein the second light transmissive member isformed with a glass material.
 3. The method according to claim 1,further comprising: mounting the light emitting element on a mountingbase.
 4. The method according to claim 1, wherein the grooves each havean oblique part spreading out from an upper face side to a lower faceside of the second light transmissive member.
 5. The method according toclaim 1, further comprising: disposing a reflective member that covers alateral face of the second light transmissive member, a lateral face ofthe first light transmissive member, and a lateral face of the lightemitting element.
 6. The method according to claim 1, wherein the firstlight transmissive member includes a silicone resin.
 7. The methodaccording to claim 2, wherein the glass material includes borosilicateglass or quartz glass.
 8. The method according to claim 1, wherein thefirst light transmissive member is bonded to the light emitting elementvia a bonding material.
 9. The method according to claim 8, wherein thebonding material covers a lateral face of the light emitting element.10. The method according to claim 1, wherein the phosphor is localizedon the lower face of the first light transmissive member.
 11. The methodaccording to claim 1,wherein an upper face of the second lighttransmissive member has an area smaller than an area of the upper faceof the light emitting element.
 12. The method according to claim 1,wherein in forming the grooves, the grooves do not reach the first lighttransmissive member block.
 13. The method according to claim 1, whereinin forming the grooves, the grooves reach the first light transmissivemember block.